点击图片查看大图执行标准: HG/T 3593-2009
Executive Standard:HG/T 3593-2009
分子式：Cu2P2O7
Molecular formula:Cu2P2O7
分子量：301.05
Molecular weight: 301.05
性状Characteristics:
本品为淡绿色或淡蓝色粉末状固体。溶于酸，不溶于水，主要用于电镀业，广泛应用于焦磷酸盐镀铜，镀青铜，镀铜锡合金等。
The product islight green or blue powdery solids, dissolves easily in acid, butinsoluble in water. Mainly used in elelctroplating, widely used in pyrophosphate copper facing, bronzing, rhinemetal andso on.
技术指标Technical Specifications:
|
指标项目 Index Specification |
电镀级 Electroplating grade |
高纯级 High purity grade |
|
外观 Appearance |
淡蓝色粉末或颗粒Light blue powder or granule |
淡蓝色粉末或颗粒 Light blue powder or granule |
|
纯度 Purity(Cu2P2O7.4H2O) % |
≥99 |
≥99.9 |
|
铜含量Copper(Cu) % |
≥34 |
≥34 |
|
铁 Ferum (Fe) % |
≤0.008 |
≤0.005 |
|
砷Arsenic(As) % |
≤0.0005 |
≤0.0003 |
|
铅Plumbum (Pb) % |
≤0.001 |
≤0.0005 |
|
重金属(以铅计) Heave metals (as Pb)% |
≤0.005 |
≤0.001 |
|
硫酸盐 Sulfate (SO4) % |
≤0.5 |
≤0.5 |
|
酸不溶物 Acid insoluble % |
≤0.1 |
≤0.05 |
使用 use:
主要用于无氰电镀，是供给镀液中铜离子的主盐。适用于装饰性保护层的铜底层和要求渗碳零件的局部防渗碳涂层。用作分析试剂,电镀添加剂，配制磷酸盐颜料。
Mainly used in cyanide-free electroplating, as the main salt ofcupric ion supplying toplating solution. Also as cupric coating of decoration, andanticarburizing paint on carburized parts.analytical reagent,Electroplating Additive, pigment forphosphate.
包装 Packing:
本品外包装采用塑料编织袋或三合一纸袋，每袋净重25kg或20kg，内衬双层塑料薄膜。
In 20/25kgs plastic woven bags net each, or in trinity paper bags lined with doule plastic film.