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应用范围：应用于在特定的基材上和晶圆上的精密电镀。
Application scope：the sophisticated plating of specific base metal and Wafers.
主要特点：机电一体化结构，设备美观紧凑，占地面积小，全自动操作（也可手动或半自动操作），设备可靠性高，适用性强，满足节能环保。
Feature: Mechanical and Electrical Integration structure, easy operation, high reliability, use countercurrent rinsing and micro drain techniques, energy saving, friendly environment.
技术规格：非标定制。
Technical Specification: Non-standard specifications, it is customized.
配套选项：计算机监控、槽液成分测定及自动补液装置、阴极移动装置等。
Options: Computer monitoring system, bath solution testing and automatic feed device, cathode shifter etc.