点击图片查看大图
美国Extec 低强度钻石切割片
Diamond Wafering Blades
EXTEC ® Low Concentration
Recommended for brittle materials such as ceramics, glass, carbides and other heat resistant materials.
| Catalog # | Unit | Diameter | Arbor | Thickness | Application |
|---|---|---|---|---|---|
|
12193
|
Each | 3.0" (76.0 mm) |
0.5" (12.7 mm) |
0.006" (0.15 mm) |
Recommended for soft friable ceramics, composites with fine reinforcing media CaF, MgF, carbon composites |
|
12195
|
Each | 5.0" (127.0 mm) |
0.5" (12.7 mm) |
0.015" (0.4 mm) |
Recommended for soft friable ceramics, composites with fine reinforcing media CaF, MgF, carbon composites |
|
12230
|
Each | 3.0" (76.0 mm) |
0.5" (12.7 mm) |
0.006" (0.15 mm) |
Recommended for ceramics, glass, alumina, zirconia, concrete, electronic substrates |
|
12235
|
Each | 4.0" (102.0 mm) |
0.5" (12.7 mm) |
0.012" (0.3 mm) |
Recommended for ceramics, glass, alumina, zirconia, concrete, electronic substrates |
|
12240
|
Each | 5.0" (127.0 mm) |
0.5" (12.7 mm) |
0.015" (0.4 mm) |
Recommended for ceramics, glass, alumina, zirconia, concrete, electronic substrates |
|
12245
|
Each | 6.0" (152.0 mm) |
0.5" (12.7 mm) |
0.02" (0.5 mm) |
Recommended for ceramics, glass, alumina, zirconia, concrete, electronic substrates |
|
12248
|
Each | 8.0" (203.0 mm) |
0.5" (12.7 mm) |
0.035" (0.9 mm) |
|
|
12250
|
Each | 7.0" (178.0 mm) |
0.5" (12.7 mm) |
0.025" (0.6 mm) |
Recommended for ceramics, glass, alumina, zirconia, concrete, electronic substrates |
|
12257
|
Each | 5.0" (127.0 mm) |
0.5" (12.7 mm) |
0.02" (0.5 mm) |
Recommended for structural ceramics, boron nitride, silicon nitride |
|
12258
|
Each | 7.0" (178.0 mm) |
0.5" (12.7 mm) |
0.025" (0.6 mm) |
Recommended for structural ceramics, boron nitride, silicon nitride |
|
12259
|
Each | 8.0" (203.0 mm) |
0.5" (12.7 mm) |
0.035" (0.9 mm) |
Recommended for structural ceramics, boron nitride, silicon nitride |