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电子封装镀层锈蚀原因分析

放大字体  缩小字体发布日期:2012-04-25  浏览次数:678

摘要:介绍了一次电子封装外壳镀层出现锈蚀故障的处理过程。该外壳基材为4J42铁镍合金,其上镀镍再镀金,短期搁置后发现锈蚀。通过锈蚀过程和机理的分析,并经过试验验证,确定了锈蚀的原因是:包装用塑料膜受到氯化物的污染,导致镍镀层和铁镍合金基材在贮存过程中发生腐蚀。在此基础上,制定了相应的质量控制措施。

关键词:集成电路封装;盖板;铁镍合金;镀镍;镀金;锈蚀;质量控制

中图分类号:TQl53.1;TGl72   文献标志码:B

文章编号:1004-227X(2009)09-0016-04

Cause analysis of corrosion of electroplated electronic packages//ZHANG Zhi-qian*,LIU Sheng-qian

Abstract:The treatment process for corrosion of electroplated coatings on electronic packaging lid was introduced.The lid material is composed of 4J42 Fe-Ni alloy.Ni and Au coatings were electroplating successively Oil it.The corrosion was found after a short-term storage.The cause of corrosion was analyzed based on corrosion process and mechanism as confirmed by experiments.The contamination of plastic packaging film by chloride resulted in the corrosion of electrodeposited Ni coating and Fe_Ni alloy substrate during storage.Some corresponding measures for quality control were given.

Keywords:integrated circuit package;lid;iron-nickel alloy;nickel electroplating;gold electroplating;corrosion;quality control

First-author's address:Hebei Semiconductor Research Institute,Shijiazhuang 05005 1,China

 

电子封装镀层锈蚀原因分析:前言

电子封装镀层锈蚀原因分析:故障描述

电子封装镀层锈蚀原因分析:问题定位

电子封装镀层锈蚀原因分析:机理分析

电子封装镀层锈蚀原因分析:故障验证及其相应的控制措施

电子封装镀层锈蚀原因分析:结语

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